US 12,394,748 B2
Substrate bonding
Kevin Stribley, Plymouth (GB); Reetta Griffiths, Plymouth (GB); Ian Murray, Plymouth (GB); Stuart Brodie, Plymouth (GB); and Sharon Farrens, Plymouth (GB)
Assigned to PLESSEY SEMICONDUCTORS LIMITED, Plymouth (GB)
Appl. No. 17/776,685
Filed by PLESSEY SEMICONDUCTORS LIMITED, Plymouth (GB)
PCT Filed Nov. 25, 2020, PCT No. PCT/EP2020/083351
§ 371(c)(1), (2) Date May 13, 2022,
PCT Pub. No. WO2021/105203, PCT Pub. Date Jun. 3, 2021.
Claims priority of application No. 1917182 (GB), filed on Nov. 26, 2019.
Prior Publication US 2022/0399302 A1, Dec. 15, 2022
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/80 (2013.01) [H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/08 (2013.01); H01L 2224/0384 (2013.01); H01L 2224/03845 (2013.01); H01L 2224/05541 (2013.01); H01L 2224/05551 (2013.01); H01L 2224/05576 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/05669 (2013.01); H01L 2224/05687 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/8013 (2013.01); H01L 2224/80203 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/13091 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A method of preparing a substrate for substrate bonding comprising:
forming a recess in a substrate surface of the substrate;
forming a bondable dielectric layer on the substrate surface of the substrate having a bonding surface on an opposite side of the bondable dielectric layer to the substrate surface, the recess and the bondable dielectric layer defining a dielectric cavity having a dielectric cavity volume;
forming a plug configured to make electrical contact to the substrate in the dielectric cavity volume, the plug having a plug volume which is less than the dielectric cavity volume, wherein the plug extends from the dielectric cavity beyond the bonding surface in a direction generally normal to the bonding surface; and
coining the plug by compressing the substrate between opposing planar surfaces such that a contact surface of the plug is made co-planar with the bonding surface.