US 12,394,737 B2
Display panel and display device
Shuya Dong, Hubei (CN); Bo Liu, Hubei (CN); and Qiang Gong, Hubei (CN)
Assigned to WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD., Wuhan (CN)
Filed by WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD., Hubei (CN)
Filed on May 28, 2024, as Appl. No. 18/676,431.
Application 18/676,431 is a continuation of application No. 17/623,375, granted, now 12,021,049, previously published as PCT/CN2021/139693, filed on Dec. 20, 2021.
Claims priority of application No. 202111546884.7 (CN), filed on Dec. 16, 2021.
Prior Publication US 2024/0312934 A1, Sep. 19, 2024
Int. Cl. H01L 23/00 (2006.01); H01L 25/18 (2023.01)
CPC H01L 24/06 (2013.01) [H01L 24/05 (2013.01); H01L 24/32 (2013.01); H01L 25/18 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/06132 (2013.01); H01L 2224/06133 (2013.01); H01L 2224/06515 (2013.01); H01L 2224/32147 (2013.01); H01L 2924/1426 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A display panel, comprising an array substrate,
wherein the array substrate comprises a display area and a bonding area, the bonding area is positioned on a side of the display area, and a driving chip and a plurality of bonding pads are provided in the bonding area;
the driving chip comprises a first area adjacent to the display area and a second area far away from the display area, a plurality of first dummy terminals are provided in the first area, a plurality of driving terminals are provided in the second area, and the plurality of the driving terminals comprise a plurality of input terminals;
the plurality of the input terminals have one-to-one correspondence with the plurality of the bonding pads; and
the array substrate comprises a base substrate, and the driving chip and the bonding pads are disposed on the base substrate; an end surface of a portion of the array substrate corresponding to the first dummy terminals away from the base substrate is higher than an end surface of a portion of the array substrate corresponding to the bonding pads away from the base substrate.