US 12,394,736 B2
Semiconductor package system and method
Hui-Min Huang, Taoyuan (TW); Chih-Wei Lin, Zhubei (TW); Tsai-Tsung Tsai, Taoyuan (TW); Ming-Da Cheng, Taoyuan (TW); Chung-Shi Liu, Hsinchu (TW); and Chen-Hua Yu, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jan. 12, 2024, as Appl. No. 18/411,314.
Application 15/268,739 is a division of application No. 14/447,371, filed on Jul. 30, 2014, granted, now 9,449,908, issued on Sep. 20, 2016.
Application 18/411,314 is a continuation of application No. 17/233,967, filed on Apr. 19, 2021, granted, now 11,901,319.
Application 17/233,967 is a continuation of application No. 16/716,106, filed on Dec. 16, 2019, granted, now 10,985,122, issued on Apr. 20, 2021.
Application 16/716,106 is a continuation of application No. 16/042,162, filed on Jul. 23, 2018, granted, now 10,510,697, issued on Dec. 17, 2019.
Application 16/042,162 is a continuation of application No. 15/268,739, filed on Sep. 19, 2016, granted, now 10,032,734, issued on Jul. 24, 2018.
Prior Publication US 2024/0153896 A1, May 9, 2024
Int. Cl. H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01)
CPC H01L 24/05 (2013.01) [H01L 21/481 (2013.01); H01L 21/486 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 23/3114 (2013.01); H01L 23/3135 (2013.01); H01L 23/481 (2013.01); H01L 23/49811 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/49861 (2013.01); H01L 23/49866 (2013.01); H01L 23/5389 (2013.01); H01L 24/07 (2013.01); H01L 24/13 (2013.01); H01L 24/19 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 21/568 (2013.01); H01L 23/49827 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05171 (2013.01); H01L 2224/05184 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29386 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/94 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/18162 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device comprising:
a first cross-section comprising an encapsulant;
a second cross-section comprising the encapsulant, a through via, a seed layer, and a conductive material;
a third cross-section comprising a semiconductor die, a protective material, the seed layer, and the conductive material, wherein the protective material comprises polyimide;
a fourth cross-section comprising the semiconductor die, the encapsulant, the seed layer, and the conductive material; and
a fifth cross section comprising the semiconductor die and the encapsulant.