US 12,394,726 B2
Method to implement wafer-level chip-scale packages with grounded conformal shield
Gianni Signorini, Garching bei Muenchen (DE); Georg Seidemann, Landshut (DE); and Bernd Waidhas, Pettendorf (DE)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 27, 2023, as Appl. No. 18/397,898.
Application 18/397,898 is a continuation of application No. 16/368,032, filed on Mar. 28, 2019, granted, now 12,080,655.
Prior Publication US 2024/0128202 A1, Apr. 18, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/552 (2006.01); H01L 21/48 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/78 (2013.01); H01L 23/3114 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
a die having a top above a bottom, and a first sidewall and a second sidewall between the top and the bottom, the second sidewall laterally opposite the first sidewall, the bottom of the die having pads thereon;
a first dielectric layer below and on the bottom of the die;
a first conductive layer below and on the first dielectric layer, the first conductive layer electrically coupled to the pads on the bottom of the die;
a second dielectric layer below and on the first conductive layer;
a second conductive layer below and on the second dielectric layer, the second conductive layer coupled to the first conductive layer by vias through the second dielectric layer;
a third dielectric layer below the second conductive layer;
a third conductive layer below and on the third dielectric layer;
solder balls coupled to the third conductive layer; and
a conductive shield over the top of the die, adjacent to the first sidewall of the die, adjacent to the second sidewall of the die, and laterally spaced apart from the solder balls, the conductive shield electrically coupled to the third conductive layer, and the third conductive layer in turn electrically coupled to one of the solder balls.