US 12,394,724 B2
Chip package structure and electromagnetic interference shielding package module thereof
Chih-Hao Liao, Taipei (TW); Hsin-Yeh Huang, Taipei (TW); and Shu-Han Wu, Taipei (TW)
Assigned to AZUREWAVE TECHNOLOGIES, INC., New Taipei (TW)
Filed by AZUREWAVE TECHNOLOGIES, INC., New Taipei (TW)
Filed on Oct. 12, 2022, as Appl. No. 17/964,868.
Claims priority of application No. 111129671 (TW), filed on Aug. 8, 2022.
Prior Publication US 2024/0047373 A1, Feb. 8, 2024
Int. Cl. H01L 23/552 (2006.01); H01L 23/544 (2006.01); H01L 25/16 (2023.01)
CPC H01L 23/552 (2013.01) [H01L 23/544 (2013.01); H01L 25/165 (2013.01); H01L 2223/54413 (2013.01); H01L 2223/54433 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A chip package structure, comprising:
a substrate having a first board surface and a second board surface that is opposite to the first board surface, wherein the substrate has a plurality of conductive portions arranged on the second board surface;
a chip module mounted on the first board surface and electrically coupled to the plurality of conductive portions;
an encapsulant formed on the first board surface, wherein the chip module is embedded in the encapsulant, and wherein the encapsulant has a patterned trench that is recessed in a top surface thereof and that corresponds in shape to a predetermined two-dimensional (2D) code pattern;
an electromagnetic interference (EMI) shielding layer covering the encapsulant, wherein the EMI shielding layer includes a recognition region formed on the top surface and an embedded region that is formed in the patterned trench; and
a recognition contrast layer filled in the patterned trench and connected to the embedded region, wherein the recognition contrast layer and the recognition region of the EMI shielding layer respectively have different colors that conform to grade A or grade B in ISO/IEC 15415 standard;
wherein an end portion of the recognition contrast layer protrudes from the top surface of the encapsulant and is coplanar with the recognition region of the EMI shielding layer, so that the recognition contrast layer and the recognition region of the EMI shielding layer jointly form the predetermined 2D code pattern having a planar shape.