US 12,394,719 B2
Methods and apparatus to increase glass core thickness
Jeremy Ecton, Gilbert, AZ (US); Brandon Marin, Gilbert, AZ (US); Srinivas Pietambaram, Chandler, AZ (US); and Bai Nie, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Sep. 22, 2021, as Appl. No. 17/482,084.
Prior Publication US 2023/0093522 A1, Mar. 23, 2023
Int. Cl. H01L 23/538 (2006.01); H01L 21/48 (2006.01)
CPC H01L 23/5383 (2013.01) [H01L 21/4857 (2013.01); H01L 21/486 (2013.01)] 23 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a first glass substrate;
a second glass substrate;
an interface layer between the first glass substrate and the second glass substrate, the interface layer coupling the first glass substrate to the second glass substrate; and
an interconnect extending through at least a portion of the first glass substrate and at least a portion of the second glass substrate, wherein the interconnect includes a first portion extending through the first glass substrate and a second portion extending through the second glass substrate, and wherein the first portion of the interconnect and the second portion of the interconnect are offset along a lateral direction.