US 12,394,715 B2
Diagonal backside power and signal routing for an integrated circuit
Sheng-Hsiung Chen, Zhubei (TW); Jerry Chang Jui Kao, Taipei (TW); Kuo-Nan Yang, Hsinchu (TW); and Jack Liu, Taipei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Nov. 22, 2023, as Appl. No. 18/517,706.
Application 18/517,706 is a continuation of application No. 17/332,072, filed on May 27, 2021, granted, now 11,854,978.
Prior Publication US 2024/0096803 A1, Mar. 21, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/528 (2006.01); G06F 30/392 (2020.01); G06F 30/394 (2020.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01)
CPC H01L 23/5286 (2013.01) [G06F 30/392 (2020.01); G06F 30/394 (2020.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit, comprising:
a device;
a frontside interconnect structure allayer positioned above the device, the frontside interconnect structure comprising a first plurality of metal conductors configured to transmit signals and one or more power signals; and
a backside interconnect structure positioned below the device, the backside interconnect structure comprising:
a second plurality of metal conductors configured to transmit one or more power signals,
wherein metal conductors in the second plurality of metal conductors are routed according to diagonal routing, the frontside interconnect structure includes a first non-functioning inverter cell and a second non-functioning inverter cell, and the backside interconnect structure includes a first diagonal metal conductor that operably connects the first non-functioning inverter cell to the second non-functioning inverter cell.