| CPC H01L 23/49838 (2013.01) [H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01)] | 8 Claims |
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1. A wiring board comprising:
a first wiring layer including a pad and a plurality of wiring patterns that are located around the pad;
a first insulating layer that covers the first wiring layer and exposes, from an upper surface thereof, surfaces of the plurality of wiring patterns and the pad;
a second insulating layer that is formed on the upper surface of the first insulating layer;
an opening portion that penetrates through the second insulating layer to the pad; and
a connecting terminal that is formed in the opening portion, that is connected to the pad, that has one end protruding from the opening portion, and that includes, at the one end, a top portion having a larger width than the pad,
wherein the top portion has an upper surface and a side surface that are not covered by another insulating layer,
the plurality of wiring patterns include two or more wiring patterns that sandwich the pad, and
the top portion of the connecting terminal extends to a position overlapping with the two or more wiring patterns on the upper surface of the second insulating layer in a plan view.
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