US 12,394,699 B2
Semiconductor devices and methods of manufacturing semiconductor devices
Roger D. St. Amand, Tempe, AZ (US); and Louis W. Nicholls, Gilbert, AZ (US)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Valley Point (SG)
Filed on Jan. 7, 2024, as Appl. No. 18/406,161.
Application 18/406,161 is a division of application No. 17/838,200, filed on Jun. 11, 2022, granted, now 11,876,039, issued on Jan. 16, 2024.
Application 17/838,200 is a division of application No. 16/805,027, filed on Feb. 28, 2020, granted, now 11,362,027, issued on Jun. 14, 2022.
Prior Publication US 2024/0162131 A1, May 16, 2024
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01)
CPC H01L 23/49816 (2013.01) [H01L 21/4853 (2013.01); H01L 21/56 (2013.01); H01L 23/3185 (2013.01); H01L 23/49822 (2013.01); H01L 24/11 (2013.01); H01L 24/73 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2224/73253 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a substrate comprising a substrate top side, a substrate bottom side, and a conductive structure, wherein:
the conductive structure comprises:
substrate top terminals adjacent to the substrate top side;
substrate bottom terminals adjacent to the substrate bottom side; and
conductive paths coupling the substrate top terminals to the substrate bottom terminals;
a first electronic component comprising:
a first electronic component first side;
a first electronic component second side opposite to the first electronic component first side; and
first component terminals adjacent to the first electronic component first side and coupled to the substrate bottom terminals;
a second electronic component comprising:
a second electronic component first side;
a second electronic component second side opposite to the second electronic component first side; and
second component terminals adjacent to the second electronic component first side;
an attachment structure coupling the second electronic component second side to the first electronic component second side; and
interconnects coupled to the substrate bottom terminals;
wherein:
the first electronic component and the second electronic component are interposed between the second component terminals and the substrate bottom side;
distal ends of the interconnects reside on a first plane;
distal ends of the second component terminals reside on a second plane different than the first plane; and
the interconnects comprise:
substrate interconnects coupled to the substrate bottom terminals; and
external interconnects coupled to the substrate interconnects.