US 12,394,697 B2
Method for fabricating a semiconductor device package comprising a pin in the form of a drilling screw
Thorsten Scharf, Kareth (DE); Thomas Bemmerl, Schwandorf (DE); Martin Gruber, Schwandorf (DE); Thorsten Meyer, Regensburg (DE); and Frank Singer, Regenstauf (DE)
Assigned to Infineon Technologies Austria AG, Villach (AT)
Filed by Infineon Technologies Austria AG, Villach (AT)
Filed on Feb. 15, 2024, as Appl. No. 18/442,173.
Application 18/442,173 is a division of application No. 17/359,824, filed on Jun. 28, 2021, granted, now 11,955,415.
Claims priority of application No. 20183913 (EP), filed on Jul. 3, 2020.
Prior Publication US 2024/0186225 A1, Jun. 6, 2024
Int. Cl. H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01)
CPC H01L 23/49811 (2013.01) [H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/49844 (2013.01); H01L 24/48 (2013.01); H01L 25/072 (2013.01); H01L 2224/48229 (2013.01); H01L 2224/48249 (2013.01); H01L 2924/18301 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A method for fabricating a semiconductor device package, the method comprising:
providing a die carrier;
disposing at least one semiconductor die on the die carrier;
electrically connecting an electrical connector with the semiconductor die or another electrical device;
applying an encapsulation layer above the semiconductor die, the die carrier, and the electrical connector; and
screwing a metallic drilling screw through the encapsulant so that an end of the metallic drilling screw contacts the electrical connector.