US 12,394,696 B2
Package structure including an array of copper pillars and methods of forming the same
Wei-Yu Chen, Hsinchu (TW); Collin Jordon Fleshman, Hsinchu (TW); and Chien-Hsun Lee, Chu-tung Town (TW)
Assigned to Taiwan Semiconductor Manufacturing Company Limited, Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company Limited, Hsinchu (TW)
Filed on May 5, 2022, as Appl. No. 17/737,298.
Claims priority of provisional application 63/322,873, filed on Mar. 23, 2022.
Prior Publication US 2023/0307330 A1, Sep. 28, 2023
Int. Cl. H01L 23/48 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/18 (2023.01)
CPC H01L 23/49811 (2013.01) [H01L 21/4853 (2013.01); H01L 23/3107 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/5385 (2013.01); H01L 24/16 (2013.01); H01L 24/96 (2013.01); H01L 25/18 (2013.01); H01L 2224/16225 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor structure comprising:
an assembly including at least one semiconductor die and an interposer including interposer bonding pads;
a packaging substrate comprising substrate bonding pads; and
an array of copper pillar structures disposed between the interposer and the packaging substrate, wherein each of the copper pillar structures is bonded to a respective interposer bonding pad on the interposer and to a respective substrate bonding pad located on the packaging substrate,
wherein:
each of the copper pillar structures is bonded to the respective substrate bonding pad through a respective substrate-side solder material portion and is bonded to the respective interposer bonding pad through a respective interposer-side solder material portion;
the assembly comprises a fan-out package containing a plurality of semiconductor dies encapsulated by a molding compound die frame and attached to the interposer through a respective array of microbumps; and
each sidewall of the molding compound die frame is vertically coincident with a respective sidewall of the interposer.