US 12,394,693 B2
Integrated circuit package with star-connected lead
Kumar Anurag Shrivastava, Bangalore (IN); and Arushi Agrawal, Bangalore (IN)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Jun. 30, 2022, as Appl. No. 17/854,526.
Prior Publication US 2024/0006273 A1, Jan. 4, 2024
Int. Cl. H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/49541 (2013.01) [H01L 21/4821 (2013.01); H01L 23/49548 (2013.01); H01L 23/49575 (2013.01); H01L 24/48 (2013.01); H01L 2224/48245 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/30107 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A packaged integrated circuit (IC) comprising:
a lead frame having a supply pin and a ground pin, the supply pin including first and second supply leads extending from a proximal portion of the supply pin, and the ground pin including first and second ground leads extending from a proximal portion of the ground pin;
a first IC network having a first supply terminal and a first ground terminal, a first conductor coupled between the first supply terminal and the first supply lead, and a second conductor coupled between the first ground terminal and the first ground lead; and
a second IC network having a second supply terminal and a second ground terminal, a third conductor coupled between the second supply terminal and the second supply lead, and a fourth conductor coupled between the second ground terminal and the second ground lead.