US 12,394,692 B2
Power circuit module
Atapol Prajuckamol, Thanyaburi (TH); Chee Hiong Chew, Seremban (MY); and Olaf Zschieschang, Sinsheim (DE)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Aug. 5, 2022, as Appl. No. 17/817,736.
Claims priority of provisional application 63/260,171, filed on Aug. 11, 2021.
Prior Publication US 2023/0052830 A1, Feb. 16, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 23/492 (2006.01); H01L 25/07 (2006.01)
CPC H01L 23/4924 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4875 (2013.01); H01L 23/3735 (2013.01); H01L 23/49811 (2013.01); H01L 23/49844 (2013.01); H01L 24/40 (2013.01); H01L 24/48 (2013.01); H01L 25/072 (2013.01); H01L 2224/40139 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/40247 (2013.01); H01L 2224/48139 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A circuit module comprising:
a substrate with a patterned metal surface, the patterned metal surface including a conductive terminal pad, a first conductive pad, and a second conductive pad, the second conductive pad being non-adjacent to the conductive terminal pad;
a first circuit portion assembled on the first conductive pad;
a second circuit portion assembled on the second conductive pad;
a conductive bridge coupled to the conductive terminal pad and the second conductive pad, the conductive bridge including an elevated span extending above and across the first conductive pad, and
at least one first semiconductor device die is disposed with a drain-side down on of the first conductive pad, and at least one second semiconductor device die is disposed with a drain-side down on the second conductive pad.