US 12,394,688 B2
Superconducting device including set of circuits having different operational temperature requirements with multiple thermal sinks and multiple ground planes
Aaron Ashley Hathaway, Baltimore, MD (US); Gregory R. Boyd, Washington, DC (US); and John X. Przybysz, Severna Park, MD (US)
Assigned to NORTHROP GRUMMAN SYSTEMS CORPORATION, Falls Church, VA (US)
Filed by NORTHROP GRUMMAN SYSTEMS CORPORATION, Falls Church, VA (US)
Filed on Apr. 9, 2024, as Appl. No. 18/630,530.
Application 18/630,530 is a division of application No. 17/222,238, filed on Apr. 5, 2021, granted, now 12,027,437.
Application 17/222,238 is a continuation of application No. 16/227,965, filed on Dec. 20, 2018, granted, now 11,004,763, issued on May 11, 2021.
Prior Publication US 2024/0355701 A1, Oct. 24, 2024
Int. Cl. H01L 23/367 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 23/66 (2006.01)
CPC H01L 23/367 (2013.01) [H01L 23/5226 (2013.01); H01L 23/5286 (2013.01); H01L 23/53285 (2013.01); H01L 23/66 (2013.01); H01L 2223/6605 (2013.01); H01L 2223/6683 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A circuit comprising:
a first dielectric layer comprising a first electrically conducting ground plane and a first set of circuits that have a first operational temperature requirement, the first dielectric layer further comprising a second electrically conducting ground plane and a second set of circuits that have a different operational temperature requirement than the first electrically conducting ground plane and the first set of circuits;
a second dielectric layer comprising a third electrically conducting ground plane and a third set of circuits that have a third operational temperature requirement, the second dielectric layer further comprising a fourth electrically conducting ground plane and a fourth set of circuits that have a different operational temperature requirement than the third electrically conducting ground plane and the third set of circuits;
a plurality of thermal sink layers; and
a plurality of conductive vias,
wherein at least one conductive via of the plurality of conductive vias couples one of the first, second, third, and fourth electrically conducting ground planes to one of the plurality of thermal sink layers.