US 12,394,680 B2
Through electrode substrate, manufacturing method thereof and mounting substrate
Hiroshi Kudo, Tokyo-to (JP); and Takamasa Takano, Tokyo-to (JP)
Assigned to DAI NIPPON PRINTING CO., LTD., Tokyo (JP)
Filed by DAI NIPPON PRINTING CO., LTD., Tokyo-to (JP)
Filed on Nov. 1, 2021, as Appl. No. 17/516,011.
Application 17/516,011 is a continuation of application No. 16/306,883, granted, now 11,195,768, previously published as PCT/JP2017/020702, filed on Jun. 2, 2017.
Claims priority of application No. 2016-112104 (JP), filed on Jun. 3, 2016.
Prior Publication US 2022/0059422 A1, Feb. 24, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/15 (2006.01); H01L 23/14 (2006.01); H01L 23/532 (2006.01)
CPC H01L 23/15 (2013.01) [H01L 23/145 (2013.01); H01L 23/53238 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A mounting substrate comprising:
a through electrode substrate; and
a circuit board connected to the through electrode substrate,
wherein the through electrode substrate comprises:
a substrate including a first surface, a second surface positioned oppositely to the first surface, and a through hole;
a through electrode inside the through hole of the substrate; and
a wiring layer provided on the first surface of the substrate,
wherein the substrate of the through electrode substrate contains glass,
wherein the through electrode comprises:
a first part spreading along a sidewall of the through hole;
a second part connected to the first part and spreading in a surface direction of the first surface; and
a third part connected to an end portion of the first part on a side of the second surface,
wherein the second part includes an outer surface positioned coplanarly with the first surface of the substrate,
wherein the wiring layer includes an electroconductive layer connected to the outer surface of the second part, and
wherein the circuit board includes a base member, and an electrode part provided on the base member and electrically connected to the third part of the through electrode substrate.