US 12,394,679 B2
Lid body, electronic component accommodation package, and electronic device
Takayuki Kimura, Omihachiman (JP); Hisaki Masuda, Hikone (JP); Yuko Tanaka, Kyoto (JP); Takayuki Ohyama, Higashine (JP); Yoshihiro Uemura, Moriyama (JP); and Hiroyuki Miura, Helsinki (FI)
Assigned to KYOCERA Corporation, Kyoto (JP)
Appl. No. 17/763,352
Filed by KYOCERA Corporation, Kyoto (JP)
PCT Filed Sep. 30, 2020, PCT No. PCT/JP2020/037188
§ 371(c)(1), (2) Date Mar. 24, 2022,
PCT Pub. No. WO2021/066024, PCT Pub. Date Apr. 8, 2021.
Claims priority of application No. 2019-178705 (JP), filed on Sep. 30, 2019.
Prior Publication US 2022/0344226 A1, Oct. 27, 2022
Int. Cl. H01L 23/06 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/06 (2013.01) [H01L 24/29 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83455 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A lid body comprising:
a base layer of the lid body that contains an alloy of iron and nickel;
a first film formed on a lower surface of the base layer, wherein the first film contains nickel; and
a second film formed on a first lower surface of the first film, wherein the second film contains copper,
wherein the lid body is configured to contact a frame portion of a base and cover a cavity formed in the base by the frame portion.