US 12,394,675 B2
Method and system for monitoring and controlling semiconductor process
Ying-Chu Yen, Taichung (TW); and Wei-Che Chang, Taichung (TW)
Assigned to Winbond Electronics Corp., Taichung (TW)
Filed by Winbond Electronics Corp., Taichung (TW)
Filed on Aug. 5, 2022, as Appl. No. 17/881,635.
Claims priority of application No. 110133570 (TW), filed on Sep. 9, 2021.
Prior Publication US 2023/0076269 A1, Mar. 9, 2023
Int. Cl. H01L 21/67 (2006.01); H01L 21/66 (2006.01); H10B 12/00 (2023.01)
CPC H01L 22/20 (2013.01) [H01L 21/67259 (2013.01); H10B 12/053 (2023.02)] 10 Claims
OG exemplary drawing
 
1. A method for monitoring and controlling a semiconductor process, comprising:
forming at least one active region on a substrate;
forming a first patterned photoresist layer for defining at least two word lines on the at least one active region after forming the at least one active region;
detecting and measuring positions and dimensions of the at least one active region and the first patterned photoresist layer and calculating estimated areas of at least two estimated contact windows in the at least one active region according to a predefined position of at least one bit line;
adjusting the predefined position of the at least one bit line according to the estimated areas of the at least two estimated contact windows in the at least one active region; and
forming a second patterned photoresist layer on the substrate, wherein the second patterned photoresist layer corresponds to the adjusted predefined position of the at least one bit line.