| CPC H01L 22/12 (2013.01) | 10 Claims |
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1. A semiconductor manufacturing process, comprising:
using a computer system to define plurality of shots on a wafer range, and a plurality of observation points are defined in each shot;
finding out parts of incomplete shots from all of the shots;
calculating the number of the observation points in each of the incomplete shots, and eliminating the incomplete shots with the number less than 3 observation points;
counting all the observation points in the remaining incomplete shots after eliminating the incomplete shots with the number less than 3 observation points, and deleting a part of the observation points until the total number of the observation points meets a preset total number, and all the observation points are uniformly distributed; and
performing an overlay measurement step on the remaining observation points after deleting a part of the observation points to generate an offset vector map.
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