US 12,394,658 B2
Method of processing plate-shaped workpiece
Nobuyuki Fukushi, Tokyo (JP); Kosei Kiyohara, Tokyo (JP); Shohei Takeda, Tokyo (JP); and Gentaro Tsuruta, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Sep. 13, 2022, as Appl. No. 17/931,591.
Claims priority of application No. 2021-156352 (JP), filed on Sep. 27, 2021.
Prior Publication US 2023/0099416 A1, Mar. 30, 2023
Int. Cl. H01L 21/683 (2006.01); B23K 26/38 (2014.01); H01L 21/67 (2006.01); H01L 21/78 (2006.01)
CPC H01L 21/6836 (2013.01) [B23K 26/38 (2013.01); H01L 21/67092 (2013.01); H01L 21/78 (2013.01); H01L 2221/68336 (2013.01); H01L 2221/68386 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method of processing a plate-shaped workpiece, comprising:
a workpiece supporting step of placing the plate-shaped workpiece on a thermocompression sheet whose area is larger than that of the plate-shaped workpiece, heating the thermocompression sheet to pressure-bond the thermocompression sheet to the plate-shaped workpiece, and supporting the plate-shaped workpiece on the thermocompression sheet without using an annular frame;
a step of gripping and securing an outer circumferential edge portion of the thermocompression sheet by means of a plurality of clamps which directly contact the outer circumferential edge portion;
a processing step of processing the plate-shaped workpiece to divide the plate-shaped workpiece into a plurality of chips; and
a pick-up step of picking up the chips from the thermocompression sheet.