US 12,394,653 B2
Wafer carrier disc installation/uninstallation device and installation/uninstallation method thereof
Mao-Yen Sung, Zhubei (TW)
Appl. No. 17/929,017
Filed by Mao-Yen Sung, Zhubei (TW)
PCT Filed Feb. 9, 2021, PCT No. PCT/CN2021/076313
§ 371(c)(1), (2) Date Aug. 10, 2022,
PCT Pub. No. WO2021/164664, PCT Pub. Date Aug. 26, 2021.
Claims priority of application No. 202010102278.5 (CN), filed on Feb. 19, 2020; and application No. 202010102312.9 (CN), filed on Feb. 19, 2020.
Prior Publication US 2023/0104871 A1, Apr. 6, 2023
Int. Cl. H01L 21/00 (2006.01); B25J 9/16 (2006.01); B25J 11/00 (2006.01); B25J 13/08 (2006.01); H01L 21/673 (2006.01); H01L 21/677 (2006.01); H01L 21/68 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67778 (2013.01) [B25J 9/1697 (2013.01); B25J 11/0095 (2013.01); B25J 13/08 (2013.01); H01L 21/67326 (2013.01); H01L 21/67766 (2013.01); H01L 21/681 (2013.01); H01L 21/68707 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A wafer carrier disc installation/uninstallation device comprising:
a first robotic arm connected with and drivable by a control module, at least an image capturing assembly being disposed at a movable end of the first robotic arm;
a second robotic arm connected with and drivable by the control module, a wafer taking/placing mechanism being disposed at a movable end of the second robotic arm;
a carrier disc disposed within a moving range of the first and second robotic arms, the carrier disc being connected with and drivable by the control module, at least one wafer disc being disposed on the carrier disc for placing a wafer on the wafer disc;
a main correction mechanism positioned within the moving range of the first and second robotic arms, the main correction mechanism being connected with and drivable by the control module to respectively correct the operation positions of the image capturing assembly and the wafer taking/placing mechanism, wherein the main correction mechanism has a lower image capturing component and a range-finding laser source is disposed on the lower image capturing component of the main correction mechanism;
a wafer correction mechanism positioned within the moving range of the second robotic arm, the wafer correction mechanism being connected with and drivable by the control module to read a code of the wafer placed therein and adjust the position of the wafer, and multiple laser sources being disposed on a locating face of the wafer locating member installation/uninstallation mechanism;
a material rest mechanism disposed within the moving range of the second robotic arm, the material rest mechanism having an internal space for receiving wafers, and
a lockable wafer locating member is secured on each wafer disc, a wafer locating member installation/uninstallation mechanism being further disposed at the movable end of the first robotic arm to install/uninstall the wafer locating member.