US 12,394,652 B2
Semiconductor substrate carrying container with front and rear openings
Matthew A. Fuller, Colorado Springs, CO (US); and Jeffery J. King, Colorado Springs, CO (US)
Assigned to ENTEGRIS, INC., Billerica, MA (US)
Filed by ENTEGRIS, INC., Billerica, MA (US)
Filed on Mar. 9, 2022, as Appl. No. 17/690,388.
Claims priority of provisional application 63/159,244, filed on Mar. 10, 2021.
Prior Publication US 2022/0293446 A1, Sep. 15, 2022
Int. Cl. H01L 21/677 (2006.01)
CPC H01L 21/67769 (2013.01) [H01L 21/67778 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A semiconductor substrate carrying container, comprising:
a front opening unified pod having a plurality of walls, a front, and a rear, the plurality of walls defining an interior space that is sized to be able to receive a plurality of semiconductor substrates therein;
a front opening at the front of the front opening unified pod and through which a semiconductor substrate is able to be removed from and inserted into the interior space;
a rear opening at the rear of the front opening unified pod and through which a semiconductor substrate is able to be removed from and inserted into the interior space; and
a cover associated with the front opening unified pod, the cover has a first position where the cover is attached to the container shell and covers the rear opening and a second position where the cover does not cover the rear opening;
wherein when the cover is at the second position a semiconductor substrate can be removed from and inserted into the interior space through the rear opening.