US 12,394,651 B2
High throughput polishing modules and modular polishing systems
Jagan Rangarajan, San Jose, CA (US); Edward Golubovsky, San Jose, CA (US); Jay Gurusamy, Santa Clara, CA (US); and Steven M. Zuniga, Soquel, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on May 11, 2020, as Appl. No. 16/871,588.
Application 16/871,588 is a continuation of application No. 16/851,012, filed on Apr. 16, 2020.
Prior Publication US 2021/0323118 A1, Oct. 21, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. B24B 37/30 (2012.01); B24B 37/04 (2012.01); B24B 37/34 (2012.01); H01L 21/306 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01)
CPC H01L 21/67745 (2013.01) [B24B 37/042 (2013.01); B24B 37/30 (2013.01); B24B 37/345 (2013.01); H01L 21/30625 (2013.01); H01L 21/6719 (2013.01); H01L 21/67219 (2013.01); H01L 21/6776 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A polishing module, comprising:
a first modular frame defining a first polishing processing region;
a second modular frame defining a second polishing processing region, the second modular frame directly adjacent the first modular frame positioned in a side-by-side arrangement;
a third modular frame defining a third polishing processing region;
a fourth modular frame defining a fourth polishing processing region, the third modular frame directly adjacent the fourth modular frame and positioned together in a side-by-side arrangement, and the third module frame and the fourth modular frame are positioned end-to-end with the first modular frame and the second modular frame;
a polishing station disposed in each of the first polishing processing region, the second polishing processing region, the third polishing processing region and the fourth polishing processing region, the polishing station comprising a polishing platen, wherein the polishing platen is rotatable about a platen axis;
a carrier loading station disposed in each of the first polishing processing region, the second polishing processing region, the third polishing processing region and the fourth polishing processing region;
a substrate handler disposed between each polishing processing region and adjacent each carrier loading station;
a substrate transfer station disposed between the polishing stations of the first and the second polishing processing regions, wherein the substrate handler is configured to transfer substrates between each carrier loading station and the substrate transfer station; and
a carrier support module disposed in each of the first polishing processing region, the second polishing processing region, the third polishing processing region and the fourth polishing processing region, each carrier support module suspended from the first modular frame, the second modular frame, the third modular frame and the fourth modular frame, and each carrier support module comprising a carrier platform comprising a first substrate carrier assembly and a second substrate carrier assembly, wherein:
the carrier platform is rotatable or pivotable about a platform axis by a platform actuator configured to rotate the first and second substrate carrier assemblies between either a first processing mode position or a second processing mode position,
the platform actuator is configured to rotate the carrier platform, the first carrier assembly and the second carrier assembly together, and
each of the first carrier assembly and the second carrier assembly comprise:
a carrier head coupled to a carrier shaft, wherein the carrier head comprises a chamber,
a rotation actuator coupled to the carrier shaft, and configured to rotate the carrier shaft and the carrier head,
a translation actuator, and
a pneumatic assembly that is in fluid communication with the chamber disposed within the carrier head,
wherein
the translation actuator is configured to cause the carrier head, the carrier shaft and the rotational actuator to translate in a first direction that extends perpendicular from the platform axis, and
the pneumatic assembly is fluidly coupled to the carrier head, and
in the first processing mode position the first substrate carrier assembly is positioned over the carrier loading station to allow for substrate loading and unloading thereinto and therefrom, and the second substrate carrier assembly is concurrently positioned over the polishing platen to allow for substrate polishing thereon, and
in the second processing mode position the second substrate carrier assembly is positioned over the carrier loading station to allow for substrate loading and unloading thereinto, and the first substrate carrier assembly is concurrently positioned over the polishing platen to allow for substrate polishing thereon.