	US 12,394,650 B2
	Semiconductor fabrication facility
Youngon Oh, Hwaseong-si (KR); Youngcheol Jang, Hwaseong-si (KR); Jihun Kim, Uiwang-si (KR); Sanghyuk Park, Yongin-si (KR); Sangho Yoon, Yongin-si (KR); Seungyeob Lee, Yongin-si (KR); Chul Min Lee, Changwon-si (KR); Hochan Lee, Seoul (KR); Jaegyun Jeon, Suwon-si (KR); Jeongkwan Jung, Anyang-si (KR); Hyeong Seok Choo, Suwon-si (KR); and Dongyeol Han, Pyeongtaek-si (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-Do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Aug. 24, 2022, as Appl. No. 17/894,371.
Prior Publication US 2023/0230864 A1, Jul. 20, 2023
Int. Cl. H01L 21/677 (2006.01)

CPC H01L 21/67733 (2013.01) [H01L 21/67706 (2013.01); H01L 21/67724 (2013.01)]

19 Claims

1. A semiconductor fabrication facility, comprising:

raceways on a ceiling of a structural construction, the raceways extending in one direction;

a vehicle rail assembly coupled to the raceways;

outer jig rails on outer sidewalls of the raceways and adjacent to the vehicle rail assembly; and

an outer jig on the outer jig rails, the outer jig including first rollers configured to rotate along the outer jig rails,

stoppers on the outer jig rails, the stoppers configured to fix the first rollers.