	US 12,394,644 B2
	Electronic device comprising a transferred portion of plurality of chips and method for manufacturing the same
Jia-Yuan Chen, Miao-Li County (TW); Tsung-Han Tsai, Miao-Li County (TW); Kuan-Feng Lee, Miao-Li County (TW); and Yuan-Lin Wu, Miao-Li County (TW)
Assigned to INNOLUX CORPORATION, Miao-Li County (TW)
Filed by InnoLux Corporation, Miao-Li County (TW)
Filed on Jan. 5, 2023, as Appl. No. 18/150,541.
Application 18/150,541 is a continuation of application No. 16/720,917, filed on Dec. 19, 2019, granted, now 11,574,895.
Prior Publication US 2023/0143381 A1, May 11, 2023
Int. Cl. H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 25/075 (2006.01); H10H 20/01 (2025.01); H10H 20/857 (2025.01); H10H 29/14 (2025.01); H10K 59/12 (2023.01)

CPC H01L 21/67144 (2013.01) [H01L 25/0753 (2013.01); H10H 20/01 (2025.01); H10H 20/857 (2025.01); H10H 29/142 (2025.01); H10K 59/12 (2023.02); H01L 21/6835 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68372 (2013.01)]

8 Claims

1. A method of manufacturing an electronic device, comprising:

providing a first substrate with a plurality of chips disposed thereon;

providing an inorganic layer over the plurality of chips;

providing a second substrate; and

transferring at least a portion of the plurality of chips to the second substrate to form a transferred portion of the plurality of chips on the second substrate;

wherein the inorganic layer fractures to form a first portion and a second portion, the first portion of the inorganic layer contacts at least the portion of the plurality of chips to separate from the second portion of the inorganic layer disposed on the first substrate.