US 12,394,642 B2
Apparatus for transferring electronic component, method for transferring electronic component and manufacturing method of light-emitting diode panel
Kuo-Pin Chuan, Taichung (TW); Sheng-Che Huang, Taichung (TW); and Shu-Hsien Huang, Taichung (TW)
Assigned to Micraft System Plus Co., Ltd., Taoyuan (TW)
Filed by Micraft System Plus Co., Ltd.
Filed on May 16, 2022, as Appl. No. 17/744,753.
Claims priority of provisional application 63/227,340, filed on Jul. 30, 2021.
Claims priority of application No. 110140161 (TW), filed on Oct. 28, 2021.
Prior Publication US 2023/0030227 A1, Feb. 2, 2023
Int. Cl. H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01)
CPC H01L 21/67132 (2013.01) [H01L 21/6835 (2013.01); H01L 24/80 (2013.01); H01L 25/167 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/80006 (2013.01); H01L 2224/80801 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A method for transferring an electronic component, the method comprising:
providing a flexible carrier, wherein an electronic component is carried on a surface of the flexible carrier;
providing a target substrate;
causing the surface of the flexible carrier with the electronic component to be disposed opposite to the target substrate;
providing a first abutting surface and a second abutting surface respectively moving toward a surface of the flexible carrier without carrying the electronic component, wherein an area of the first abutting surface is greater than an area of the second abutting surface;
moving the first abutting surface and the second abutting surface so that at least the second abutting surface contacts the surface of the flexible carrier without carrying the electronic component, wherein the electronic component abuts against the target substrate, and a space is formed between the flexible carrier and the first abutting surface;
a negative pressure is generated in the space; and
causing the second abutting surface to leave the flexible carrier.