US 12,394,639 B2
Substrate drying device and substrate drying method
Tomoatsu Ishibashi, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Filed by EBARA CORPORATION, Tokyo (JP)
Filed on Jun. 27, 2022, as Appl. No. 17/850,309.
Claims priority of application No. 2021-107175 (JP), filed on Jun. 29, 2021.
Prior Publication US 2023/0005762 A1, Jan. 5, 2023
Int. Cl. H01L 21/67 (2006.01); H01L 21/66 (2006.01)
CPC H01L 21/67034 (2013.01) [H01L 21/67051 (2013.01); H01L 22/30 (2013.01)] 1 Claim
OG exemplary drawing
 
1. A substrate drying device comprising:
a substrate holding unit configured to hold a substrate;
a gas generator configured to generate a drying gas including at least IPA vapor, the drying gas is for drying the substrate; and
a drying gas nozzle configured to supply the drying gas to a surface of the substrate, wherein
the gas generator further comprising a filter for filtering the drying gas; and wherein
the filter has a filter size F that is set to enable the followings:
(1) a defect size D allowed in a defect test after the drying of the substrate is set to 20 nm or less, and
(2) 4 or more of a ratio of the defect size D over the filter size F.