US 12,394,620 B2
Benzyl compound passivation for selective deposition and selective etch protection
Feng Q. Liu, San Jose, CA (US); Mark J. Saly, Santa Clara, CA (US); and David Thompson, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Oct. 28, 2022, as Appl. No. 17/976,440.
Prior Publication US 2024/0145232 A1, May 2, 2024
Int. Cl. H01L 21/02 (2006.01); C23C 16/02 (2006.01); C23C 16/34 (2006.01); C23C 16/40 (2006.01); C23C 16/455 (2006.01)
CPC H01L 21/02118 (2013.01) [C23C 16/0272 (2013.01); C23C 16/34 (2013.01); C23C 16/40 (2013.01); C23C 16/45525 (2013.01); H01L 21/02227 (2013.01); H01L 21/0228 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method comprising:
forming a first layer and a second layer on a substrate;
forming a passivation layer on a surface of the first layer without forming the passivation layer on a surface of the second layer by exposing the first layer and the second layer to a benzyl compound and causing catalytic polymerization of the benzyl compound using the first layer; and
after forming the passivation layer on the first layer, performing at least one processing step with respect to the second layer selectively.