US 12,394,595 B2
Multi-antenna unit for large area inductively coupled plasma processing apparatus
Shouqian Shao, Fremont, CA (US); Tae Kyung Won, San Jose, CA (US); Chien-Teh Kao, Sunnyvale, CA (US); and Jianhua Zhou, Campbell, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Nov. 15, 2022, as Appl. No. 17/987,259.
Claims priority of provisional application 63/282,341, filed on Nov. 23, 2021.
Prior Publication US 2023/0162948 A1, May 25, 2023
Int. Cl. H01J 37/32 (2006.01)
CPC H01J 37/32119 (2013.01) 20 Claims
OG exemplary drawing
 
1. A lid suitable for use in a semiconductor processing chamber, comprising:
a plurality of dielectric windows coupled to a perforated faceplate;
a plurality of support members coupled to the perforated faceplate and positioned between adjacent dielectric windows; and
a plurality inductive couplers positioned adjacent the dielectric window;
wherein each dielectric window of the plurality of dielectric windows has at least a portion of two of the inductive couplers of the plurality of the inductive couplers positioned thereover.