| CPC H01F 27/288 (2013.01) [H01F 27/2804 (2013.01); H01F 27/40 (2013.01); H01G 4/30 (2013.01); H01G 4/40 (2013.01); H01F 2027/2809 (2013.01)] | 13 Claims |

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1. A multilayer electronic component comprising:
a common port;
a first signal port that selectively passes a first signal of a frequency within a first passband;
a second signal port that selectively passes a second signal of a frequency within a second passband higher than the first passband;
a first resonator provided between the common port and the first signal port in a circuit configuration;
a second resonator provided between the common port and the second signal port in the circuit configuration;
a stack for integrating the common port, the first signal port, the second signal port, the first resonator, and the second resonator, the stack including a plurality of dielectric layers and a plurality of conductor layers stacked together; and
a shield that is formed of a conductor and covers a part of a surface of the stack, wherein:
the first and second resonators are formed using the plurality of conductor layers;
the stack has a bottom surface and a top surface located at both ends in a stacking direction of the plurality of dielectric layers, and four side surfaces connecting the bottom surface and the top surface;
the shield includes a specific portion opposed to both the first and second resonators;
a distance between the second resonator and the specific portion is greater than a distance between the first resonator and the specific portion; and
the first resonator is not interposed between the second resonator and the specific portion.
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