US 12,394,481 B2
Electronic devices including support pillars in slot regions, and related memory devices, systems, and methods
Darwin A. Clampitt, Wilder, ID (US); John D. Hopkins, Meridian, ID (US); and Roger W. Lindsay, Boise, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Feb. 9, 2022, as Appl. No. 17/668,304.
Prior Publication US 2023/0253043 A1, Aug. 10, 2023
Int. Cl. G11C 16/04 (2006.01); H10B 41/10 (2023.01); H10B 41/27 (2023.01); H10B 41/35 (2023.01); H10B 43/10 (2023.01); H10B 43/27 (2023.01); H10B 43/35 (2023.01)
CPC G11C 16/0483 (2013.01) [H10B 41/10 (2023.02); H10B 41/27 (2023.02); H10B 41/35 (2023.02); H10B 43/10 (2023.02); H10B 43/27 (2023.02); H10B 43/35 (2023.02); H01L 2225/06541 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a stack comprising tiers of alternating conductive levels and insulative levels overlying a source;
slots extending vertically through the stack and dividing the stack into blocks;
support pillars within the slots and extending vertically through the stack, the support pillars exhibiting a lateral dimension in a first horizontal direction relatively larger than a lateral dimension of the slots in the first horizontal direction, substantially orthogonal to a second horizontal direction in which the slots extend; and
a barrier material divided into discrete structures by the support pillars, the discrete structures of the barrier material within the slots and laterally separating the support pillars from one another in the second horizontal direction, a single line of the support pillars extending in the second horizontal direction within the slots, and the discrete structures of the barrier material extending between adjacent support pillars in the second horizontal direction.