US 12,394,433 B1
Joining components from wafers having different pattern densities
Paula Frances McElhinney, Londonderry (GB); Brendan Lafferty, Donegal (IE); and Marcus Benedict Mooney, Donegal (IE)
Assigned to Seagate Technology LLC, Fremont, CA (US)
Filed by Seagate Technology LLC, Fremont, CA (US)
Filed on May 19, 2021, as Appl. No. 17/324,493.
Claims priority of provisional application 63/030,364, filed on May 27, 2020.
Int. Cl. G11B 5/31 (2006.01); G11B 5/00 (2006.01)
CPC G11B 5/3173 (2013.01) [G11B 2005/0021 (2013.01); Y10T 29/49032 (2015.01)] 15 Claims
OG exemplary drawing
 
1. A method, comprising:
forming a first set of recording head components on a first wafer at a first pattern density;
forming a second set of recording head components on a second wafer at a second pattern density that is less than half that of the first pattern density; and
joining the first and second set of recording head components to form respective recording head subassemblies.