US 12,393,764 B2
Thermally coupled aware device placement
Akil Khamisi Sutton, Poughkeepsie, NY (US); Peter A Smith, Wappingers Falls, NY (US); Glen A. Wiedemeier, Austin, TX (US); William Edward Ansley, Round Rock, TX (US); and John Greg Massey, Jericho, VT (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Jan. 4, 2022, as Appl. No. 17/567,978.
Prior Publication US 2023/0214573 A1, Jul. 6, 2023
Int. Cl. G06F 30/398 (2020.01); G06F 30/392 (2020.01); G06F 30/3947 (2020.01)
CPC G06F 30/398 (2020.01) [G06F 30/392 (2020.01); G06F 30/3947 (2020.01)] 17 Claims
OG exemplary drawing
 
1. A method for thermally coupled aware device placement, the method comprising:
obtaining a schematic design of a macro, the schematic design including a plurality of devices disposed within the macro;
determining an initial temperature for each of the plurality of devices, wherein the initial temperature due to self-heating;
determining, iteratively for each of the plurality of devices, an uplift temperature, wherein the uplift temperature for a first device of the plurality of devices is calculated by adding the initial temperature of the first device to a sum of each of the initial temperatures of each of the other plurality of devices multiplied by a coupling factor, which is a continuous function of the distance between the first device and each of the other plurality of devices; and
based on a determination that the uplift temperature of at least one of the plurality of devices is above a threshold value, modifying the schematic design of the macro,
wherein the threshold level for each of the plurality of devices is determined based on the characteristics of the device.