US 12,393,126 B2
Sub micron particle detection on burl tops by applying a variable voltage to an oxidized wafer
Tammo Uitterdijk, Wilton, CT (US)
Assigned to ASML Holding N.V., Veldhoven (NL)
Appl. No. 18/012,317
Filed by ASML Holding N.V., Veldhoven (NL)
PCT Filed Jun. 4, 2021, PCT No. PCT/EP2021/065079
§ 371(c)(1), (2) Date Dec. 22, 2022,
PCT Pub. No. WO2021/259619, PCT Pub. Date Dec. 30, 2021.
Claims priority of provisional application 63/042,760, filed on Jun. 23, 2020.
Prior Publication US 2023/0314962 A1, Oct. 5, 2023
Int. Cl. G03F 7/00 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01)
CPC G03F 7/70783 (2013.01) [G03F 7/70708 (2013.01); H01L 21/67288 (2013.01); H01L 21/6831 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A substrate comprising:
an electrostatic wafer comprising a first substrate layer, a second substrate layer, a substrate surface, and an electrical connection, wherein:
the first substrate layer comprises a semiconducting material;
the second substrate layer comprises an insulating material;
the substrate surface is disposed on the second substrate layer; and
the electrical connection is configured to:
receive a voltage; and
transmit the voltage to the first substrate layer to electrostatically clamp the substrate to a substrate table while a flatness of the substrate surface is measured.