US 12,393,116 B2
Pattern forming method, photosensitive resin composition, cured film, laminate, and device
Kenta Yamazaki, Shizuoka (JP); and Toshihide Aoshima, Shizuoka (JP)
Assigned to FUJIFILM Corporation, Tokyo (JP)
Filed by FUJIFILM Corporation, Tokyo (JP)
Filed on Jun. 2, 2021, as Appl. No. 17/336,337.
Application 17/336,337 is a continuation of application No. PCT/JP2019/046157, filed on Nov. 26, 2019.
Claims priority of application No. 2018-228556 (JP), filed on Dec. 5, 2018.
Prior Publication US 2021/0302836 A1, Sep. 30, 2021
Int. Cl. G03F 7/037 (2006.01); G03F 7/004 (2006.01); G03F 7/033 (2006.01); H01L 23/00 (2006.01); G03F 7/20 (2006.01)
CPC G03F 7/037 (2013.01) [G03F 7/0045 (2013.01); G03F 7/033 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); G03F 7/2006 (2013.01); H01L 2224/214 (2013.01); H01L 2224/215 (2013.01); H01L 2924/07025 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A pattern forming method comprising:
an exposure step of exposing a photosensitive film to laser light; and
a development step of developing the photosensitive film after the exposure to obtain a pattern,
wherein the photosensitive film contains at least one precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor, an onium salt, and a compound having a plurality of carboxy groups and having a molecular weight of 1,000 or less.