US 12,392,974 B2
Embedding a photonic integrated circuit in a semiconductor package for high bandwidth memory and compute
Ankur Aggarwal, Pleasanton, CA (US); Subal Sahni, Santa Clara, CA (US); Philip Winterbottom, San Jose, CA (US); and Martinus Bos, San Jose, CA (US)
Assigned to Celestial AI Inc., Santa Clara, CA (US)
Filed by Celestial AI Inc., Santa Clara, CA (US)
Filed on Feb. 21, 2024, as Appl. No. 18/583,749.
Claims priority of provisional application 63/616,465, filed on Dec. 29, 2023.
Prior Publication US 2025/0216598 A1, Jul. 3, 2025
Int. Cl. G02B 6/42 (2006.01); G02B 6/12 (2006.01); G02B 6/124 (2006.01); G02B 6/13 (2006.01); G02B 6/43 (2006.01); H01L 21/56 (2006.01); H01L 25/16 (2023.01)
CPC G02B 6/12002 (2013.01) [G02B 6/124 (2013.01); G02B 6/13 (2013.01); G02B 6/42 (2013.01); H01L 21/56 (2013.01); H01L 25/167 (2013.01); G02B 2006/12107 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A package comprising:
a photonic integrated circuit (PIC) disposed on a substrate and comprising a semiconductor die having an active portion and a passive portion mutually coupled, the active portion being configured to consume electrical power when activated, and the passive portion comprising an optical transmission medium configured to propagate an optical signal to or from the active portion of the PIC;
a cavity formed on a side of the semiconductor die that is opposite from the substrate, the cavity being filled with an optically transparent medium with an optical refractive index substantially matching that of the optical transmission medium such that the optical signal can be received from or transmitted to the passive portion of the PIC through the cavity;
a fiber array unit (FAU) mounted on the cavity to couple the optical signal to or from outside the package; and
an electronic integrated circuit (EIC) electrically coupled to the active portion of the PIC and comprising components that electrically operate on the active portion of the PIC,
wherein the active portion of the PIC comprises an optical modulator or a photodetector or both, and the EIC comprises a driver or a transimpedance amplifier or both,
the drive being coupled to the optical modulator on the PIC and configured to drive the optical modulator such that information contents are modulated on the optical signal, and the transimpedance amplifier being coupled to the photodetector and configured to operate on the photodetector such that modulated optical signals are converted to electrical signals.