US 12,392,971 B2
Optical emission assembly and optical module
Chung-Hsin Fu, Taipei (TW); Min-Sheng Kao, Taipei (TW); Yi-Tseng Lin, Taipei (TW); and Chih-Wei Yu, Taipei (TW)
Assigned to DONGGUAN XUNTAO ELECTRONIC CO., LTD., Dongguan (CN); and DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD., Dongguan (CN)
Filed by DONGGUAN XUNTAO ELECTRONIC CO., LTD., Dongguan (CN); and Dongguan Luxshare Technologies Co., Ltd, Dongguan (CN)
Filed on Jun. 2, 2023, as Appl. No. 18/205,093.
Claims priority of application No. 202211671154.4 (CN), filed on Dec. 26, 2022.
Prior Publication US 2024/0210639 A1, Jun. 27, 2024
Int. Cl. G02B 6/42 (2006.01); G02B 6/43 (2006.01)
CPC G02B 6/4268 (2013.01) [G02B 6/4214 (2013.01); G02B 6/4266 (2013.01); G02B 6/4272 (2013.01); G02B 6/428 (2013.01); G02B 6/43 (2013.01); G02B 6/4204 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An optical emission assembly, comprising:
a heat dissipation base comprising a heat dissipation body, and a first heat dissipation plate and a second heat dissipation plate extending from the heat dissipation body along a first direction, the first heat dissipation plate and the second heat dissipation plate forming a T-shaped structure or an L-shaped structure, two adjacent sides of the second heat dissipation plate being respectively connected to a surface of the heat dissipation body and a surface of the first heat dissipation plate, and the heat dissipation body being provided with a through hole along the first direction;
a converging lens disposed in the through hole of the heat dissipation body;
an adapter, one end of the adapter being inserted into the through hole of the heat dissipation body;
a light-emitting assembly disposed on the second heat dissipation plate and comprising a plurality of light-emitting chips;
a multiplexer disposed on the second heat dissipation plate, located between the plurality of light-emitting chips and the converging lens, and configured to combine light beams emitted by the plurality of light-emitting chips into one light beam, and make the one light beam converge to the adapter through the converging lens;
a cooling chip disposed on a surface of the first heat dissipation plate opposite to the surface of the first heat dissipation plate connected to the second heat dissipation plate;
a heat-conducting housing, one end of the heat-conducting housing being provided with a first through hole along the first direction and a second through hole along a second direction, the first direction and the second direction being perpendicular to each other; wherein the heat dissipation base, the plurality of light-emitting chips, the multiplexer and the cooling chip are disposed in the heat-conducting housing, the adapter extends out of the heat-conducting housing through the first through hole, and the cooling chip is disposed corresponding to the second through hole; and
a heat-conducting glue filled in the second through hole and between the cooling chip and the heat-conducting housing, so as to make the cooling chip thermally connect to the heat-conducting housing.