US 12,392,966 B2
Optical module
Cheng-Ling Huang, Kaohsiung (TW); and Ying-Chung Chen, Kaohsiung (TW)
Assigned to ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung (TW)
Filed by Advanced Semiconductor Engineering, Inc., Kaohsiung (TW)
Filed on Dec. 30, 2022, as Appl. No. 18/092,146.
Prior Publication US 2024/0219641 A1, Jul. 4, 2024
Int. Cl. G02B 6/293 (2006.01)
CPC G02B 6/29301 (2013.01) 14 Claims
OG exemplary drawing
 
1. An optical module, comprising:
a carrier;
a lid disposed over the carrier, wherein the carrier and the lid are collaboratively define a first cavity for accommodating a photonic component; and
a first electrical contact disposed over a first side of the lid and configured to provide an electronic connection for the optical module,
wherein a first aperture penetrating the lid and corresponds to a light transmission/reception area of the photonic component,
and wherein the lid is configured to provide a vertically electrical path to electrically connect the first electrical contact,
wherein the lid has a first portion extending from an upper surface of the carrier and a second portion connected to the first portion and over the photonic component, wherein the first electrical contact is disposed over an upper surface of the second portion.