US 12,392,962 B2
Method for integration of electro-optical materials in a photonic integrated circuit
Long Chen, Marlboro, NJ (US)
Assigned to Cisco Technology, Inc., San Jose, CA (US)
Filed by Cisco Technology, Inc., San Jose, CA (US)
Filed on Mar. 24, 2023, as Appl. No. 18/189,668.
Prior Publication US 2024/0319440 A1, Sep. 26, 2024
Int. Cl. G02B 6/136 (2006.01); G02B 6/12 (2006.01); G02B 6/132 (2006.01)
CPC G02B 6/136 (2013.01) [G02B 6/12004 (2013.01); G02B 6/132 (2013.01); G02B 2006/1204 (2013.01); G02B 2006/12047 (2013.01); G02B 2006/12085 (2013.01); G02B 2006/12197 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A method comprising:
providing a sacrificial wafer, comprising a substrate and an electro-optical material strip disposed within a dielectric matrix deposited over the substrate;
contacting the sacrificial wafer to a photonic device wafer,
wherein the photonic device wafer comprises a photonic device die, and
wherein the electro-optical material strip is disposed proximate to the photonic device die; and
bonding the sacrificial wafer to the photonic device wafer.