US 12,392,959 B2
Optical waveguide connecting device
Vinay Vashishtha, Chandler, AZ (US); Mudit Bhargava, Austin, TX (US); Brian Tracy Cline, Austin, TX (US); Saurabh Pijuskumar Sinha, San Antonio, TX (US); and Gregory Munson Yeric, Austin, TX (US)
Assigned to Arm Limited, Cambridge (GB)
Appl. No. 17/288,498
Filed by Arm Limited, Cambridge (GB)
PCT Filed Oct. 23, 2019, PCT No. PCT/GB2019/053021
§ 371(c)(1), (2) Date Apr. 23, 2021,
PCT Pub. No. WO2020/084306, PCT Pub. Date Apr. 30, 2020.
Application 17/288,498 is a continuation of application No. 16/172,505, filed on Oct. 26, 2018, granted, now 10,641,953, issued on May 5, 2020.
Prior Publication US 2021/0389520 A1, Dec. 16, 2021
Int. Cl. G02B 6/12 (2006.01); G02B 6/26 (2006.01); G02B 6/42 (2006.01)
CPC G02B 6/12002 (2013.01) [G02B 6/12016 (2013.01); G02B 6/262 (2013.01); G02B 6/4226 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method comprising:
forming at least a first waveguide segment in a solid structure;
forming at least a second waveguide segment in the solid structure, the first waveguide segment and the second waveguide segment forming parallel waveguide segments; and
forming at least a third waveguide segment to connect the first waveguide segment and the second waveguide segment,
wherein:
the third waveguide segment to connect the first waveguide segment and the second waveguide segment to form a waveguide structure spanning within the solid structure;
the solid structure comprises first exterior dimensions matching dimensions of a cavity or channel formed in a first integrated circuit device, the first exterior dimensions of the solid structure match the dimensions of the cavity or channel so as to align an exposed portion of the first waveguide segment to optically couple with one or more waveguides of the first integrated circuit device;
the solid structure further comprises second exterior dimensions so as to align an exposed portion of the second waveguide segment to optically couple with one or more waveguides of a second integrated circuit device; and
the first and second exterior dimensions are configured to couple the first and second integrated circuit device in a vertical stack arrangement; and
the third waveguide segment to be configured to transmit optical signals between the one or more waveguides of the first integrated circuit device and the one or more waveguides of the second integrated circuit device while in the vertical stack arrangement.