US 12,392,802 B2
Circuit board, probe card substrate, and probe card
Hitoshi Tega, Kyoto (JP); and Daisuke Jingu, Kyoto (JP)
Assigned to KYOCERA Corporation, Kyoto (JP)
Appl. No. 17/780,058
Filed by KYOCERA Corporation, Kyoto (JP)
PCT Filed Nov. 27, 2020, PCT No. PCT/JP2020/044277
§ 371(c)(1), (2) Date May 26, 2022,
PCT Pub. No. WO2021/107115, PCT Pub. Date Jun. 3, 2021.
Claims priority of application No. 2019-214387 (JP), filed on Nov. 27, 2019.
Prior Publication US 2022/0413015 A1, Dec. 29, 2022
Int. Cl. G01R 1/073 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01)
CPC G01R 1/07307 (2013.01) [H05K 1/0212 (2013.01); H05K 1/0306 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A circuit board comprising:
an insulating substrate formed by a plurality of ceramic insulating layers being layered on one another and having a first surface and a second surface on an opposite side to the first surface;
a plurality of circuit conductors passing through an inside of the insulating substrate and positioned in a region from the first surface to the second surface; and
at least one heating wire positioned in, among a plurality of interlayer regions between the ceramic insulating layers in the insulating substrate, at least one interlayer region between the ceramic insulating layers, wherein
the at least one heating wire has a mesh shape having a plurality of first through holes through which portions of the circuit conductors pass and having a plurality of second through holes through which the circuit conductors do not pass.