US 12,392,564 B2
Multi-channel thin heat exchanger and manufacturing method of the same
Jen-Chih Cheng, New Taipei (TW)
Assigned to COOLER MASTER CO., LTD., Taipei (TW)
Filed by COOLER MASTER CO., LTD., Taipei (TW)
Filed on May 26, 2023, as Appl. No. 18/324,531.
Application 18/324,531 is a division of application No. 17/154,923, filed on Jan. 21, 2021, granted, now 11,703,287.
Claims priority of provisional application 62/964,131, filed on Jan. 22, 2020.
Prior Publication US 2023/0296333 A1, Sep. 21, 2023
Int. Cl. F28F 3/12 (2006.01); H05K 7/20 (2006.01); F28F 3/14 (2006.01)
CPC F28F 3/12 (2013.01) [H05K 7/20309 (2013.01); H05K 7/20318 (2013.01); F28F 3/14 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A heat dissipation device, comprising:
a first metal sheet including a plurality of through-holes;
a second metal sheet including a first plurality of channels, a first interconnecting channel, and a second interconnecting channel that are formed within the second metal sheet, the first interconnecting channel is directly connected to ends of two or more of channels of a first set of channels of the first plurality of channels and the second interconnecting channel is directly connected to ends of two or more channels of a second set of channels of the first plurality of channels; and
a third metal sheet including a second plurality of channels, wherein
the first metal sheet, the second metal sheet, and the third metal sheet are coupled to each other, and the first metal sheet is disposed between the second metal sheet and the third metal sheet, and
the first plurality of channels and the second plurality of channels are in fluid communication with each other through the plurality of through-holes.