US 12,392,458 B2
LED lamp
Yusaku Kawabata, Kyoto (JP)
Assigned to ROHM CO., LTD., Kyoto (JP)
Filed by Rohm Co., Ltd., Kyoto (JP)
Filed on Feb. 8, 2023, as Appl. No. 18/166,374.
Application 18/166,374 is a continuation of application No. 17/235,784, filed on Apr. 20, 2021, granted, now 11,608,941.
Application 17/235,784 is a continuation of application No. 17/008,007, filed on Aug. 31, 2020, granted, now 11,629,826.
Application 17/008,007 is a continuation of application No. 16/242,090, filed on Jan. 8, 2019, abandoned.
Application 16/242,090 is a continuation of application No. 15/707,759, filed on Sep. 18, 2017, granted, now 10,190,729.
Application 15/707,759 is a continuation of application No. 14/968,100, filed on Dec. 14, 2015, granted, now 9,797,554.
Application 14/968,100 is a continuation of application No. 13/202,910, granted, now 9,234,632, previously published as PCT/JP2010/052870, filed on Feb. 24, 2010.
Prior Publication US 2023/0184394 A1, Jun. 15, 2023
Int. Cl. F21K 9/233 (2016.01); F21K 9/27 (2016.01); F21K 9/68 (2016.01); F21Y 103/10 (2016.01); F21Y 105/10 (2016.01); F21Y 115/10 (2016.01); H01L 25/075 (2006.01); H10H 20/853 (2025.01); H10H 20/855 (2025.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01)
CPC F21K 9/233 (2016.08) [F21K 9/27 (2016.08); F21K 9/68 (2016.08); H01L 25/0753 (2013.01); H10H 20/853 (2025.01); H10H 20/856 (2025.01); H10H 20/857 (2025.01); F21Y 2103/10 (2016.08); F21Y 2105/10 (2016.08); F21Y 2115/10 (2016.08); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/01021 (2013.01); H10H 20/855 (2025.01)] 13 Claims
OG exemplary drawing
 
1. An LED lamp comprising:
a substrate;
a plurality of LEDs mounted on a mount surface of the substrate; and
a light-transmitting cover covering the plurality of LEDs,
wherein each of the plurality of LEDs comprises:
a package body having a bottom surface;
a first lead having a first bottom surface that is exposed from the bottom surface of the package body and a first top surface that is opposite to the first bottom surface;
a second lead spaced apart from the first lead in a first direction and having a second bottom surface that is exposed from the bottom surface of the package body;
an LED chip electrically connected to the first lead and the second lead; and
a transparent sealing resin covering the LED chip,
wherein the first bottom surface has a first area when viewed in a second direction perpendicular to the first bottom surface,
wherein the first area has a first length in the first direction and a first width in a third direction perpendicular to the first and second directions, the first width being constant in the first direction,
wherein the first length of the first area is larger than the first width of the first area,
wherein the bottom surface of the package body has a width in the third direction that is larger than the first width of the first area of the first bottom surface of the first lead, and
wherein the first bottom surface is bonded to the mount surface of the substrate.