US 12,392,036 B1
Inline codeposition modular multi-flux evaporation source with integrated reactive vapor manifold
Walter Seaman, Tucson, AZ (US); and Billy Jack Stanbery, Austin, TX (US)
Assigned to HelioSourceTech, LLC, Tucson, AZ (US)
Filed by HelioSourceTech, LLC, Tucson, AZ (US)
Filed on Feb. 22, 2022, as Appl. No. 17/677,815.
Claims priority of provisional application 63/161,038, filed on Mar. 15, 2021.
This patent is subject to a terminal disclaimer.
Int. Cl. C23C 16/448 (2006.01); C23C 16/06 (2006.01); C23C 16/455 (2006.01); C23C 16/52 (2006.01); H10F 77/12 (2025.01)
CPC C23C 16/45561 (2013.01) [C23C 16/06 (2013.01); C23C 16/4485 (2013.01); C23C 16/45563 (2013.01); C23C 16/52 (2013.01); H10F 77/126 (2025.01)] 11 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
an inline reactive codeposition modular multi-flux evaporative source with integrated vapor manifold system comprising
a first integrated evaporation and vapor distribution manifold including
a first evaporation source comprising a first melt crucible and a first metal distribution nozzle that distributes metal from the first melt crucible, the first evaporation source emitting, when in operation, a first flux plume from the first metal distribution nozzle toward a first reactive codeposition zone on a substrate; and
a first vapor distribution manifold coupled to a first external source material reservoir that is not part of an internal volume of the inline reactive codeposition modular multi-flux evaporative source, the first vapor distribution manifold comprising a first vapor nozzle that distributes vapor from the first external source material reservoir, the first vapor distribution manifold integrated with the first evaporation source, the vapor distribution manifold emitting, when in operation, a first vapor flux plume from the first vapor nozzle toward the first reactive codeposition zone on the substrate; and
a second integrated evaporation and vapor distribution manifold including a second evaporation source coupled to the first evaporation source, the second evaporation source comprising a second melt crucible and a second metal distribution nozzle that distributes metal from the second melt crucible, the second evaporation source emitting, when in operation, a second flux plume from the second metal distribution nozzle toward a second reactive codeposition zone on the substrate; and
a second vapor distribution manifold coupled to a second external source material reservoir that is not part of the internal volume of the inline reactive codeposition modular multi-flux evaporative source, the second vapor distribution manifold comprising a second vapor nozzle that distributes vapor from the second external source material reservoir, the second vapor distribution manifold integrated with the second evaporation source, the second vapor distribution manifold emitting, when in operation a second vapor flux plume from the second vapor nozzle toward the second reactive codeposition zone on the substrate.