US 12,392,026 B2
Method and device for substrate processing
Tamaki Takeyama, Yamanashi (JP); Hiroaki Chihaya, Yamanashi (JP); Motoi Yamagata, Tokyo (JP); Manabu Nakagawasai, Tokyo (JP); and Shinji Orimoto, Yamanashi (JP)
Assigned to Tokyo Electron Limited, Tokyo (JP)
Appl. No. 17/638,736
Filed by TOKYO ELECTRON LIMITED, Tokyo (JP)
PCT Filed Jul. 21, 2020, PCT No. PCT/JP2020/028289
§ 371(c)(1), (2) Date Feb. 25, 2022,
PCT Pub. No. WO2021/039218, PCT Pub. Date Mar. 4, 2021.
Claims priority of application No. 2019-157145 (JP), filed on Aug. 29, 2019.
Prior Publication US 2022/0220606 A1, Jul. 14, 2022
Int. Cl. C23C 14/54 (2006.01); C23C 14/34 (2006.01); C23C 14/50 (2006.01); H01L 21/687 (2006.01); H01L 21/683 (2006.01)
CPC C23C 14/541 (2013.01) [C23C 14/34 (2013.01); C23C 14/505 (2013.01); H01L 21/68764 (2013.01); H01L 21/6833 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for processing a substrate, comprising:
preparing a substrate processing device including a rotatable stage on which a substrate is placed, a frozen heat transfer body fixed on a backside of the stage with a gap interposed therebetween and cooled to an extremely low temperature, a gas supply mechanism configured to supply to the gap a cooling gas for transferring a cold heat of the frozen heat transfer body to the stage, a rotation mechanism configured to rotate the stage, and a processing mechanism configured to process the substrate; and
controlling the substrate processing device by a controller,
wherein the controller is configured to:
cool the stage to an extremely low temperature by supplying the cooling gas to the gap between the stage and the frozen heat transfer body without the substrate being disposed on the stage,
after the stage is cooled to the extremely low temperature and before the the substrate is placed on the stage, preheat the stage to increase a temperature of the stage from the extremely low temperature to a steady cooling temperature within a fixed range that is greater than the extremely low temperature; and
after the stage is preheated to the steady cooling temperature, continuously process each of a plurality of substrates by the processing mechanism while rotating the stage that has reached the steady cooling temperature in a state where the substrate on the stage has a specific temperature higher than or equal to room temperature is placed on the stage.