US 12,391,856 B2
Adhesive composition
So Young Kim, Daejeon (KR); Seung Min Lee, Daejeon (KR); Se Woo Yang, Daejeon (KR); Hyun Sup Lee, Daejeon (KR); and Yeon Soo Kim, Daejeon (KR)
Assigned to LG Chem, Ltd., Seoul (KR)
Appl. No. 16/336,037
Filed by LG CHEM, LTD., Seoul (KR)
PCT Filed Sep. 25, 2017, PCT No. PCT/KR2017/010548
§ 371(c)(1), (2) Date Mar. 22, 2019,
PCT Pub. No. WO2018/056776, PCT Pub. Date Mar. 29, 2018.
Claims priority of application No. 10-2016-0122469 (KR), filed on Sep. 23, 2016.
Prior Publication US 2020/0172771 A1, Jun. 4, 2020
This patent is subject to a terminal disclaimer.
Int. Cl. C09J 175/16 (2006.01); C08K 3/013 (2018.01); C08K 3/22 (2006.01); C08K 3/36 (2006.01); C08K 5/00 (2006.01); C08K 5/1515 (2006.01); C09J 123/22 (2006.01); C09J 123/26 (2006.01); C09J 133/08 (2006.01); C09J 147/00 (2006.01); C09J 163/00 (2006.01); C09J 175/04 (2006.01); H10K 50/844 (2023.01)
CPC C09J 175/16 (2013.01) [C08K 3/013 (2018.01); C08K 3/22 (2013.01); C08K 3/36 (2013.01); C08K 5/0025 (2013.01); C08K 5/1515 (2013.01); C09J 123/22 (2013.01); C09J 123/26 (2013.01); C09J 133/08 (2013.01); C09J 147/00 (2013.01); C09J 163/00 (2013.01); C09J 175/04 (2013.01); C08K 2003/2206 (2013.01); C08K 2201/005 (2013.01); C08K 2201/006 (2013.01); C09J 2203/326 (2013.01); C09J 2423/00 (2013.01); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01); H10K 50/844 (2023.02)] 17 Claims
OG exemplary drawing
 
1. An adhesive composition for encapsulating an organic electronic element comprising:
an olefin compound having at least one reactive functional group;
a curable compound;
a reactive diluent; and
a photo-cationic initiator and a radical initiator; a thermosetting agent and a radical initiator; or a thermosetting agent and a photo-cationic initiator,
wherein the curable compound comprises an epoxy acrylate or a urethane acrylate,
wherein the reactive diluent has a weight average molecular weight of less than 400 and is comprised in an amount of 10 to 100 parts by weight relative to 100 parts by weight of the olefin compound,
wherein the adhesive composition has a zero shear viscosity η0 in a range of 200 Pa·s to 18,000 Pa·s at any one shear rate of 0.02 to 50s−1 and at a temperature of 25° C., and
wherein the adhesive composition is a solventless-type liquid at 25° C.