US 12,391,850 B2
Dielectric substrate and method of forming the same
Jennifer Adamchuk, Marlborough, MA (US); Dale Thomas, Rochdale (GB); Meghann White, Bedford, NH (US); Sethumadhavan Ravichandran, Shrewsbury, MA (US); and Gerard T. Buss, Bedford, NH (US)
Assigned to VERSIV COMPOSITES LIMITED, Kilrush (IE)
Filed by VERSIV COMPOSITES LIMITED, Kilrush (IE)
Filed on Dec. 9, 2021, as Appl. No. 17/643,450.
Claims priority of provisional application 63/126,109, filed on Dec. 16, 2020.
Prior Publication US 2022/0186082 A1, Jun. 16, 2022
Int. Cl. C09J 7/29 (2018.01); B32B 7/12 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); B32B 27/28 (2006.01); C09J 5/00 (2006.01); C09J 7/38 (2018.01); C09J 11/04 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/46 (2006.01)
CPC C09J 7/29 (2018.01) [B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/281 (2013.01); C09J 5/00 (2013.01); C09J 7/381 (2018.01); C09J 11/04 (2013.01); H05K 1/0373 (2013.01); H05K 1/09 (2013.01); H05K 3/4644 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2264/1021 (2020.08); B32B 2307/204 (2013.01); B32B 2307/732 (2013.01); B32B 2457/08 (2013.01); C09J 2203/326 (2013.01); C09J 2301/41 (2020.08); C09J 2400/166 (2013.01); C09J 2427/00 (2013.01); C09J 2427/006 (2013.01); C09J 2479/086 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0209 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A copper clad laminate comprising a copper foil layer, and a dielectric substrate overlying the copper foil layer, wherein the dielectric substrate comprises:
a first fluoropolymer based adhesive layer, a polyimide layer in direct contact with the fluoropolymer based adhesive layer, and a first filled polymer layer overlying the polyimide layer,
wherein the first filled polymer layer comprises a first resin matrix component comprising a perfluoropolymer; and
a first ceramic filler component,
wherein the first ceramic filler component comprises a first filler material comprising a silica filler material,
wherein the silica filler material further comprises a mean particle size of at not greater than about 10 microns,
wherein a particle size distribution of the silica filler material comprises a D10 of at least about 0.2 microns and not greater than about 1.6 microns, and
wherein a particle size distribution of the silica filler material comprises a D50 of at least about 0.5 microns and not greater than about 2.7 microns.