US 12,391,783 B2
Polymer compound, and resin composition containing said compound
Yasumasa Akatsuka, Tokyo (JP); and Shigeo Hayashimoto, Tokyo (JP)
Assigned to Nippon Kayaku Kabushiki Kaisha, Tokyo (JP)
Appl. No. 18/014,902
Filed by Nippon Kayaku Kabushiki Kaisha, Tokyo (JP)
PCT Filed Jun. 30, 2021, PCT No. PCT/JP2021/024697
§ 371(c)(1), (2) Date Jan. 6, 2023,
PCT Pub. No. WO2022/009744, PCT Pub. Date Jan. 13, 2022.
Claims priority of application No. 2020-118416 (JP), filed on Jul. 9, 2020.
Prior Publication US 2023/0250209 A1, Aug. 10, 2023
Int. Cl. C08F 279/00 (2006.01); C09J 151/00 (2006.01)
CPC C08F 279/00 (2013.01) [C09J 151/003 (2013.01)] 13 Claims
 
1. A polymer compound represented by a following formula (1):

OG Complex Work Unit Chemistry
wherein in formula (1), R1 and R2 each independently represent a hydrogen atom or a methyl group, and wherein m and n are average numbers of repeating units and each independently represent a real number within the range of 1 to 2,000,
wherein the polymer compound has a number average molecular weight of 11,000 to 300,000.