US 12,391,044 B2
Fluid ejection device with break(s) in cover layer
Michael W. Cumbie, Corvallis, OR (US); Anthony M. Fuller, Corvallis, OR (US); and Chien-Hua Chen, Corvallis, OR (US)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Filed by Hewlett-Packard Development Company, L.P., Spring, TX (US)
Filed on Jul. 14, 2023, as Appl. No. 18/222,369.
Application 18/222,369 is a continuation of application No. 17/311,593, granted, now 11,745,507, previously published as PCT/US2019/029620, filed on Apr. 29, 2019.
Prior Publication US 2023/0356527 A1, Nov. 9, 2023
Int. Cl. B41J 2/14 (2006.01); B41J 2/16 (2006.01)
CPC B41J 2/1433 (2013.01) [B41J 2/162 (2013.01); B41J 2/1637 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A fluid ejection device, comprising:
a fluid ejection die comprising a first bondpad, a second bondpad, and a plurality of fluid ejectors; and
a cover layer adjacent to the fluid ejection die, the cover layer comprising:
a first region to encapsulate the first bondpad;
a second region comprising a plurality of nozzles to couple the plurality of fluid ejectors with an exterior of the fluid ejection device;
a third region to encapsulate the second bondpad;
a first break in the cover layer between the first region and the second region; and
a second break in the cover layer between the second region and the third region.