US 12,390,978 B2
Imprint method and method for manufacturing article
Tomomi Funayoshi, Tokyo (JP); and Ryosuke Hamamoto, Tokyo (JP)
Assigned to CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on May 13, 2021, as Appl. No. 17/319,191.
Claims priority of application No. 2020-088834 (JP), filed on May 21, 2020.
Prior Publication US 2021/0362399 A1, Nov. 25, 2021
Int. Cl. G03F 7/00 (2006.01); B29C 35/08 (2006.01); B29C 59/02 (2006.01); B29C 59/16 (2006.01); G03F 7/20 (2006.01)
CPC B29C 59/16 (2013.01) [B29C 35/0805 (2013.01); B29C 35/0894 (2013.01); B29C 59/022 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An imprint method comprising:
a first pattern forming process of arranging an imprint material on a first pattern forming region on a substrate and bringing a mold having a pattern into contact with the imprint material on the first pattern forming region on the substrate such that a first pattern is formed on the first pattern forming region and a portion of protruding imprint material is formed outside of the first pattern forming region;
a first exposure process of exposing the imprint material on the first pattern forming region in which the first pattern has been formed by the first pattern forming process and making an amount of exposure for the imprint material on a partial region of the first pattern forming region smaller than an amount of exposure for the imprint material on the other region of the first pattern forming region such that the imprint material on the partial region of the first pattern forming region and the portion of protruding imprint material formed outside of the first pattern forming region are not cured by the first exposure process;
a second pattern forming process, performed after the first pattern forming process, of arranging an imprint material on a second pattern forming region on the substrate and bringing the mold into contact (i) with the imprint material on the second pattern forming region on the substrate to form a second pattern, (ii) with the portion of protruding imprint material formed outside of the first pattern forming region, and (iii) with the imprint material on the partial region of the first pattern forming region, the second pattern forming region and the first pattern forming region being horizontally-adjacent pattern forming regions on the substrate; and
a second exposure process of (i) exposing the imprint material on the second pattern forming region in which the second pattern has been formed by the second pattern forming process and (ii) exposing the uncured imprint material on the partial region of the first pattern forming region.