US 12,390,887 B2
Method for separating substrates
Charles Rimbert-Riviere, Soest (DE); and Sven Buchholz, Dortmund (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on May 2, 2022, as Appl. No. 17/734,205.
Claims priority of application No. 21172725 (EP), filed on May 7, 2021.
Prior Publication US 2022/0355418 A1, Nov. 10, 2022
Int. Cl. B23K 26/38 (2014.01); B23K 26/402 (2014.01); B23K 103/00 (2006.01); H01L 21/48 (2006.01)
CPC B23K 26/38 (2013.01) [B23K 26/402 (2013.01); B23K 2103/52 (2018.08); H01L 21/4807 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A method for separating substrates, comprising:
forming a plurality of perforations in a ceramic mastercard by a first laser process, wherein forming the plurality of perforations comprises reducing a first thickness of the ceramic mastercard to a second thickness along first predefined lines; and
after forming the plurality of perforations, separating the mastercard into multiple parts by cutting through an entire thickness of the ceramic mastercard along a plurality of second predefined lines by a second laser process, wherein one or more of the second predefined lines intersects with one or more of the perforations,
wherein each of the multiple parts of the mastercard forms one of a plurality of separate substrates or is configured to be further divided into two or more separate substrates, and
wherein one or more sacrificial areas remain attached to each of at least a subset of the plurality of separate substrates, wherein each sacrificial area is separated from a main body of a respective separate substrate by one or more of the perforations.